–From Prototyping to Volume Manufacturing the New Facility Allows for Custom Design and Fabrication of Sub-10 GHZ Integrated Passive Devices (IPD). Also available is the LC-IDP PDK and Design Guide–

DENVER–(BUSINESS WIRE)–INTERNATIONAL MICROWAVE SYMPOSIUM ––3D Glass Solutions (3DGS), an innovative pure-play glass foundry, today announces its main LC-IPD process line on APEX® photosensitive glass ceramic is ready for volume production.

Complete with the proven LC-IPD PDK and design guide, the company offers demonstrated superior RF performance in a compact device size with excellent simulation to measurement matching. With the new facility online and proven design-to-product flow, rapid prototyping is available with a proven path to high volume production.

“RF applications are constantly evolving,” says Jeb Fleming, CTO and Founder. “New designs are frequently mandating lower loss and cost, in an ever-shrinking package size. By providing the RF community with a proven design-to-production flow, we are enabling fast-turn product development in an in-demand technology platform that combines industry leading RF filter performance with increased system-level integration. We are now ready to assist customers with their challenging custom designs.”

The glass ceramic based IPD technology is a low loss RF platform technology that significantly reduces power consumption in RF devices. Featuring High-Q inductors with Q-factors over 90 and high-Q capacitors with values over 250, the IPD technology node is ideally suited for frequencies between 0.1 and 10GHz. Additionally, the integration of through glass vias enables the integration of system-level components onto the glass package, further increasing system-level integration. 3DGS’ locked process flow significantly shortens manufacturing throughput time for reduced time to market. The technology node’s high yield, scalable process delivers a high correlation between simulation and final product for expedited product development. Designed in a compact, highly integrated electronic package, the IPD technology node can be used for the creation of:

  • Wireless handheld and infrastructure devices
  • Internet Infrastructure components
  • Interposers, inductor networks
  • BAW/SAW bandwidth widening
  • Bandpass filters, baluns
  • Bias Ts, couplers
  • PA matching networks

The IPD technology node PDK is available for download now. For more information, contact sales@3dgsinc.com or (505) 916-5590. 3DGS is attending the 2021 Internal Microwave Symposium, 21 – 24 June 22 in Denver, Colorado. Visit us at booth 6057 to learn more.

About 3D Glass Solutions

3D Glass Solutions (3DGS) is an innovative pure-play glass foundry enabling its customers to design novel, high-frequency 3D components that are manufactured in the 3DGS brand new, state-of-the-art, 40,000+ sq ft manufacturing facility. Your design – 3DGS manufacturing – your product. Leveraging the unique properties of our patented APEX glass-ceramic material, 3DGS technology enables performance much better than traditional 2D components. The result is Integrated Passive Devices (IPD) in the RF space with superior electrical performance and ultra-low transmission loss at high frequencies ranging from 1 to 500+ GHz. Using traditional semiconductor processes, 3DGS produces cost-effective, high-precision, high-volume-scale components that meet the needs of consumer, commercial, and mil/aero systems.

Contacts

Jacqueline Townsend Konstanturos

Townsend Team

jackie@townsendteam.com